SMT Solution - Hexi

Reflow Oven and Wave Soldering Machine

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HEXI Reflow Oven

RF Series Lead-Free Reflow Oven

  • Windows XP operation software with Chinese and English alternative. Whole system under integration control can analyze and display the failure. All production data can be saved completely and analyzed.
  • PC&Siemens PLC controlling unit with stable performance; high precision of profile repetition can avoid product loss attributed by abnormal running of the computer.
  • Unique design of the thermal convection of the heating zones from 4 sides provides high heat efficiency; hight temperature difference between 2 joins zones can avoid the temperature interference; It can shorten the temperature difference between big-size and small component and meet the soldering demand of complex PCB.
  • Forced air cooling or water cooling chiller with efficient cooling speed suits all different kinds of lead-free soldering paste.
  • Low power consumption (8-10 KWH/hour) to save the manufacture cost.
  • With complete alarms system, failures can be listed on the PC interface.

MODEL: RF-820-LF

Download Brochure
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Operation System

  • Basing on Windows XP opertion software, both English and Chinese versions are available.
  • Many functions can be achieved automatically on PC.
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Conveying System

  • AI-alloy rail dealt with surface oxidation process ensures high intensity and little distortion.
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Control System

  • Siemens PLC+Industrial PC ensures precise controlling unit and stabilized performance.
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Rail Width

  • Rail width can be adjusted synchronously from 4 points, width difference tolerance:1mm.
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Air Cooling System

  • Forcible air cooling with low temperature complies with the demand of lead-free process.
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Modularized Heaters

  • Modularized heaters can be removed for maintenance conveniently.
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UPS Power

  • UPS provide backup power of the machine, and PCB will not be damaged while breaking-off or overheating.
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Temperature Control System

  • High temperature uniformity inside the chamber provides efficient heat utilization and conduction.

SF-820-LF Leed-Free Reflow Oven

  • Windows XP operation software with Chinese and English alternative. Whole system under integration control can analyze and display the failure. All production data can be saved completely and analyzed.

MODEL: SF-820-LF

  • PC&Siemens PLC controlling unit with stable performance; high precision of profile repetition can avoid product loss attributed by abnormal running of the computer.
  • Unique design of the thermal convection of the heating zones from 4 sides provides high heat efficiency; hight △T between 2 joins zones can avoid the temperature interference; it can shorten the temperature difference between big-size and small component and meet the soldering demand of complex PCB.
  • Forced air coolin or water cooling chiller with efficient cooling speed suits all different kinds of lead-free soldering paste.
  • Low power consumption (8-10 KWH/hour) to save the manufacture cost.
  • With complete alarms system, failures can be listed on the PC interface.
  • KICC 24/7 option can simulate the Profile.
Download Brochure
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Operation System

  • Basing on Windows XP opertion software, both English and Chinese versions are available.
  • Many functions can be achieved automatically on PC.
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Conveying System

  • Adjustable central support can meet the soldering demand of big sized PCB and can prevent its bending and distortion. (option)
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Control System

  • Siemens PLC+Industrial PC with precise controlling unit and stabilized performance.
  • To analyze the machine failure, to display the alarms list, and to save it in the computer.
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Heating System

  • Unique design of the thermal convection of the heating zones from 4 sides, hight △T between 2 joins zones can avoid the temperature interference.
  • Rectifier board made by 8mm aluminum board with good heat preservation, high thermal stability and fully thermal conduction.
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Flux Reclaim System

  • Three layers of filters can reclaim 80% flux from the chamber efficiently.
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Cooling System

  • New type internal water cooling chiller can cool the PCB quickly, which can meet the cooling demand of complex board.
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N2 System

  • Fullpackaging chamber with low consumption of N2:20-30m3/hour, Oxygen density≤800PPM.
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Temperature Control System

  • High temperature uniformity inside the chamber provides efficient heat utilization and conduction.

HEXI Wave Soldering Machine

VS-350-LF Leed-free Wave Soldering Machine

  • Touch screen + PLC controlling unit, easy and reliable operation.
  • External streamline design and modularized design inside is not only nice-looking but also easy for maintenance.
  • Flux sprayer creates good atomization with low consumption of flux.
  • Turbo-fan exhausting with shielding curtain can prevent atomized flux spreading to the preheating zones and ensure the operation safety.
  • Modularized heaters in perheating convenient for maintenance; Heating under PID control achieves stable temperature and smooth profile, which can solve the difficulty during lead-free process.
  • Soldering pot employing high-strength and distortion-free cast iron produces super thermal efficiency. Wave spouts made of Titanium ensures little thermal distortion and low oxidation.
  • With automatic timing start-up and power-off of whole machine.

MODEL: VS-350-LF

Download Brochure
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Turbo Fan System

  • Turbo fan used for exhausting ensure the safety of operation personnel.
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Control System

  • Siemens PLC+Industrial PC with precise controlling unit and stabilized performance.
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Air Cooling System

  • Forced air cooling can cool the PCB after soldering efficiently.
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2nd Air Cooling System

  • Cooling fan at the exit produce the forcible air cooling for 2nd time to PCB.
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Preheating Method

  • Preheating method: Ceramic piping with infrared ray. Temp control PID+SSR.
  • IR panel after preheating compensate the heat to PCB before soldering and reduce the heat impact.
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Control Unit

  • Touch screen +PLC controlling unit, easy and reliable operation.
  • Wave height and temperature are controlled by integration system with high automation.
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Soldering Pot

  • Soldering pot Chamber made of cast iron with erosion-proof and distortion-proof.

Wave spouts – made of Titanium.

  • Solder wave can be started automatically according to the PCBs conveyor. Height of Dancer wave and laminar wave are controlled separately by inverter.
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Flux Sprayer System

  • No-bar cylinder controlling flux sprayer unit gives high uniformity of flux distributing.

WS-350-PC-N Wave Soldering Machine

  • Windows XP operation software with Chinese and English alternative available, whole machine under integration control can display the failure and save all production data for further analysis.
  • External streamline design and modularized design inside is not only nice-looking but alse easy for maintenance.
  • Flux sprayer creates good atomization with low consumption of flux.
  • Turbo-fan exhausting with shielding curtain can prevent atomized flux spreading to the preheating zones and ensure the operation safety.
  • Modularized heaters in preheating convenient for maintenance; Heating under PID control achieves stable temperature and smooth profile, which can solve the difficulty during lead-free process.
  • Soldering pot employing high-strength and distortion-free cast iron produces super thermal efficiency. Wave spouts made of Titanium ensures little thermal distortion and low oxidation.
  • With automatic timing start-up and power-off of whole machine.

MODEL: WS-350-PC-N

Download Brochure
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Turbo Fan System

  • Turbo fan used for exhausting ensure the safety of operation personnel.
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Control System

  • Siemens PLC+Industrial PC with precise controlling unit and stabilized performance.
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Air Cooling System

  • High-power turbo blowers driven by motor can cool the PCB quickly.
  • Impingement cool air strengthens the cooling slope and lowers the PCB temperature at exit.
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2nd Air Cooling System

  • Cooling fan at the exit produce the forcible air cooling for 2nd time to PCB.
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Preheating Method

  • Adjustable forced impingement convection for preheating ensures maximum heat uniformity. Separate control of 4 heating sections ensures soldering process.
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Software System

  • Basing on Windows XP operation software, both English and Chinese versions are available. Each unit of the machine can be monitored easily from the main interface.
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Nitrogen packaging System

  • Nitrogen packaging system : Oxygen content density can be observed, monitored and adjusted. N2 consumption: 25M3/hr, O2 density≤800PPM.
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Flux Sprayer System

  • Drawer design of the flux sprayer system has equipped 2 filters, easy for cleaning and maintenance.
  • Flux sprayer equipped with automatic cleaning keep sprayer smooth, low wastage of the flux.
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Soldering Pot

  • Soldering pot: Chamber – made of iron with erosion-proof and distortion-proof.
  • Solder wave can be started automatically according to the PCBs conveyor. Hight of dancer wave and laminar wave are controlled separately by inverter.
  • Wave shedding angel and flow velocity can be adjusted by an outlet adjustable knob.