The Valor Process Preparation module is a complete engineering solution for DFx, process development and test engineering for PCB assembly operations. It improves the efficiency and quality of PCB assembly with tools such as optimized front-end DFA analysis, BOM validation, stencil design, SMT programming and line balancing.
ODB++ provides an intelligent, single data-structure for transferring PCB designs into fabrication, assembly and test. It is supported by an active community of CAD and CAM tool vendors, via an open, inclusive partnering program.